SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

来源:Reuters发布于 2026-08-27

South Korean chipmaker SK Hynix on Thursday ‌held a groundbreaking ceremony for an advanced packaging and research facility in Indiana worth more than $4 billion, expanding its U.S. footprint to meet ...

相关标的:SKHY

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